Sputtering gun
Designed by Arrayed Materials. The angle of the target can be adjusted in situ by software.
Sputtering gun
Designed by Arrayed Materials. The angle of the target can be adjusted in situ by software.
The shield is higher than the target;
Special designing avoids short circuit in sputtering gun;
The angle of the target can be adjusted in situ by software, which has better repetitiveness;
The sputtering can be focused onto wafer automatically, depending on defferent T-S distance;
Easy for cleaning and target exchange;
Compatible with DC, pulsed DC, and RF power supply.
